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The Electroless Nickel and Electroless Palladium Immersion Gold Process,ENEPIG for PCB Plating

  • Description
Product Detail

    Introduction

    The Electroless Nickel and Electroless Palladium Immersion Gold process is applied in PCB(ENEPIG) , with process feature of no skip plating, no black pads, moderated phosphorous content and strong corrosion resistance. The plating coating also has excellent solderability and bondability, can take the place of the ENIG and ENIG+OSP process.

     

    Application

    The Electroless Nickel and Electroless Palladium Immersion Gold process(ENEPIG) can be used in the plating process of printed circuit board and replace the process of ENIG and ENIG+OSP.

     

    Application examples


    Printed-Circuit-Boar-Flexible-Printing-Circuit-Plating.jpg


    Representative Process

    IMT-6100 Electroless Nickel Plating Process

    IMT-6065 Electroless Palladium Plating Process

    IMT-6500 Electroless Gold Plating Process

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Highnic Group

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